CAB's vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.

CAB's vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.

Compact, fast and economical device for PCBs with pre-scored groove.
 

Separates milled PCBs carefully and fast.The matrix consists of two parts. This ensures easy and cost-saving change of the blades. Compressed air is used for the separation process. The operating pressure can be set on the machine. When the foot switch is pressed, the off-cut is punched out.