The µPlacer is a selective Pick and Place system for complex components like Ultra-Fine-Pitch- or BGA-technics. Post-placement of such components is no longer a problem at all. Furthermore we give the possibility to upgrade the µPlacer to an adequate rework system for complex components.By using a controlled temperature profile it can be used for soldering and desoldering, but also for reballing of BGAs. Software modules make it possible to record the rework process by themselves as described in ISO9000.