BF18D-P40 is a bench-top model AOI that is suitable for inspection at the final quality assurance of various types of production. With its compact body employing various functions equivalent to inline AOI, the fast offline inspection maximizes productivity. With top 40mm and bottom 60mm clearances, it can inspect on those manually inserted components. Operation and the format of data are identical so that it can be connected to optional tools for inline AOI to have coordinate operation.

BF-Tristar enabled the world first simultaneous inspections on double sided board for post reflow process. SAKI’s line scanning technology made it possible to achieve high speed inspection at less than 25 seconds. 10μ resolution inspection on both sides of M size board proposes new style of inspection at the final stage  of produciton. It can be used for pre-reflow or post printing inspection by BF-Planet-X to push single PPM line quality. Additionally, it is also suitable for the inspection after functional test before out to the market.

BF-Frontier employs those knowhow from the BF-Planet-X for inspection on L size board. Our unique machine sequence enabled speeding up of scanning and stabilization of illumination system. Both mechanism and software has been improved greatly. It achieved the inspection within 25 seconds for large size board. 1/3 of the motherboard of laptop around the world is checked by this BF-Frontier.

BF-Planet-X, the compact and high sophisticated AOI, is our standard inline model which can be used for inspection at any process: post printing, pre-reflow, and post reflow inspection. The superior resolution, 10μm with New Brilliant MLT lighting as well as our specialized fast processing software provides various and stable capability to inspect solder filet on the small components such as highly density mounted 0201(0603) chip and 0.4mm pitch lead.

BF-Voyager offers a compact foot print bench-top system for large PCBs with complete software compatibility to the Saki inline AOI systems. This model provides excellent top and bottom clearance capabilities to inspect tall components or connectors. (top: 40 mm / 1.57 inches, bottom: 60 mm / 2.36 inches) to inspect tall components or connectors after the wave soldering process.